| Quicklinx: | CLMRWS00 |
|---|---|
| Mfr#: | Z270M-ITX/ac |
Armor Your VR Machine
Prepare yourself well to enjoy the impressive world of Virtual Reality. Before that, you have to make sure everything is qualified, including hardware, software and drivers. Motherboard is the key to connect every critical components and ASRock’s VR Ready motherboards are definitely the one you’re looking for. The premium qualify is assured by rigorous testing during development. The sturdy components and rock-slid performance makes you completely immersive in the VR scenario. Users can be assured to experience VR enjoyments without any compatibility problems.
Ultra M.2 32 Gb/s (PCIe Gen3 x4 & SATA3)
The PCIe Gen3 x4 Ultra M.2 interface pushes data transfer speeds up to 32Gb/s. In addition, it also supports SATA3 6Gb/s M.2 modules, and is compatible with ASRock’s U.2 Kit for installing some of the world’s fastest U.2 PCIe Gen3 x4 SSDs.
Dual Intel® LAN
Users are able to connect two LAN cables to this motherboard's rear I/O. Dual LAN with Teaming function enabled on this motherboard allows two single connections to act as one single connection for twice the transmission bandwidth, making data transmission more effective. (Teaming is not supported with Windows® 10.)
Intel® Optane™ Memory Ready
Supports Intel® Optane™ memory technology and Intel® Optane™ storage technology that redeflnes a new standard of high performance and responsiveness.
Dual Band 802.11ac WiFi
No one has time for weak WiFi signals and sluggish internet! That's why this motherboard comes with a 802.11ac WiFi (2.4G / 5G WiFi) module which supports wireless networks and Bluetooth v4.0.
Premium Power Choke
Compared to traditional chokes, ASRock’s premium power chokes effectively make the saturation current up to three times better, thus providing enhanced and improved Vcore voltage to the motherboard.
Dual-Stack MOSFET (DSM)
Dual-Stack MOSFET (DSM) is another innovative MOSFETs design by ASRock. The silicon die area is increased by stacking two dies into one MOSFET. The larger the die area, the lower Rds(on). Compared to traditional discrete MOSFET, DSM with larger die area provides extreme lower Rds(on) 1.2 mO, so the power supply for the CPU Vcore is more efficient.